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        Products and Services

        We offer a wide range of PCB products including conventional PCBs, HDI PCBs, flexible PCBs, rigid-flex PCBs, backplane assemblies, and IC substrates. We also offer value-added services to support our customers' needs.

        TTM services also include Electro-Mechanical Solutions (E-MS). Our products in this area include sheet metal design and fabrication, backplane assembly, system integration, test and logistics for a complete solution supporting sub-system and full system integration requirements.

        Printed Circuit Board Fabrication

        Conventional PCB

        • Multilayer up to 60+ layers
        • Embedded passives
        • Heavy copper up to 10 oz.
        • Over 50 UL approved laminates
        • Thickness up to 0.450"
        • Thin core dielectrics
        • Dimensions up to 30" x 54"
        • Mixed dielectrics

        HDI

        • Up to 12L "anylayer" stacked uVia Structure
        • 1.6 / 2.0 mil line / space
        • Wide material and surface finish selections
        • 14 mil, 6L ultra thin structure
        • 3/7 mil uVia / Pad size
        • 0.4 mm pitch BGA with 2 traces fanout
        • Embedded, distributed and discrete passive components

        Flex & Rigid-Flex

        • Type 2, 3 and 4 (double sided, multilayer and rigid-flex)
        • 30+ layers
        • Dimensions up to 24" x 48"
        • Acrylic, epoxy and adhesive-less polyimide flex materials
        • Over 50 rigid material options
        • Thickness up 0.300"
        • Bikini cut, bookbinder and loose leaf construction
        • Combination surface finishes
        • Epoxy fillet

        RF & Microwave

        • High frequency / bandwidth designs
        • Planar and screened resistors
        • Dimensions up to 24" x 48"
        • Mixed dielectrics (hybrids)
        • Dielectric foam
        • Conductive paste
        • Plated cavities
        • Formed (conformal) PCBs
        • Optical machining

        Thermal Management

        • Passive and active designs
        • Buried metal core constructions
        • Externally mounted heatsinks
        • Epoxy and B-stage films
        • Thermal & conductive bonding
        • Aluminum & copper base materials
        • Various surface finishes
        • In-house milling and bonding

        IC Substrate

        • 2,4,6 Layers (2+2+2 stacked via)
        • BT material
        • Wire bonding (ENEPIG, Soft gold, Hard gold)
        • Type: SIP,CSP,BOC & FC package
        • Fine trace width/space 25/25um
        • Thin board: 130um(2L), 170um(4L)
        • Flip chip C4 pad

        Custom Assembly

        Backplanes

        • Dimensions up to 28" x 52"
        • Thickness up to 0.400"
        • Custom and Industry Standard
        • Press-fit (compliant a€“pin)
        • Surface mount (chip, QFP, BGA)
        • Wave / selective solder
        • AOI & X-ray inspection
        • Level 2, 3 & 4 testing
        • Conformal coating

        Flex & Rigid-Flex

        • Dimensions up to 22" x 52"
        • Passive & active components
        • Press-fit (compliant-pin)
        • Surface mount (chip, QFP, BGA)
        • AOI & X-ray inspection
        • Level 2,3, & 4 testing

        RF & Microwave

        • Dimensions up to 22" x 34"
        • Blind via, surface mount, thru-hole
        • 1-piece hermetic GPO and GPPO
        • X-ray inspection
        • RF testing (20+ GHz)

        Integrated Assembly

        • Card cage through cabinet
        • Backplanes & Midplanes
        • Harnessing & cabling
        • Power supplies & fan trays
        • Peripherals & controllers
        • I/O interfaces
        • Functional testing
        • Mil & Aero conduction cooled
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