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        Assembly & System Integration

        TTM offers a one-stop solution leveraging our world class capabilities in manufacturing of complex PCB's and backplane assemblies through full system integration and testing. With real emphasis on bringing world class solutions to our customers in key markets such as Communications, Military and Aerospace, Automotive and Industrial and Medical.

        TTM's ability to leverage our world class PCB, backplane and metal capabilities in lower cost regions allows us to deliver best in class "all under one roof" model solutions to our customers. These wide ranging capabilities allow TTM to deliver world class solutions that benefits the customer's quality, delivery and total cost of acquisition. In addition to a variety of capabilities ranging from level 1 to level 5 integration, TTM also has expertise in many specialized assemblies (including flex and rigid-flex).

        Backplane & System Integration

        Integrated Assembly

        Backplanes

        • Press-fit (Compliant - pin)
        • Military QPL (MIL-28870)
        • Compression Mount
        • Surface Mount
        • Wave / Selective Solder
        • Up to 48" x 36"
        • Up to 0.450"+ PCB Thick
        • AOI of Connectors / Pins
        • X-Ray Inspection
        • Level 2/3 Testing (to 44k test points)
        • In Circuit (Level 4)
        Backplanes

        System Integration

        • Back Panel Assembly and Test
        • Card Cages, Racks and Chassis
        • Cooling and Power Distribution
        • Copper and Fiber Optic Cabling
        • Full Cabinet Assembly
        • System Design, Simulation and Modeling
        • PCBA Assembly and Test
        • Commercial and Military Qualifications
        • Global Manufacturing
        Standards Based

        Standards Based

        • VME / VME64x
        • VITA41© (VXS)
        • VITA46© (VPX)
        • CompactPCI™
        • microTCA™

        Custom & Specialty Product

        Rigid-Flex

        Rigid-flex

        • Press-Fit, SMT & Thru-Hole Assembly
        • MIL-Spec, Types 1,2,3,4
        • Up to 36" x 24"
        • Heavy Copper (High Current Configs.)
        • Passive/Active Comps.
        • Integration w/ Rigid PCBs
        • AOI Inspection
        • X-Ray Inspection
        • Level 2/3 Testing (to 44k test points)
        • Design Services
        RF/Microwave

        RFMicrowave

        • 1-Piece Hermetic SMP / SMPM
        • Blind Solder Interconnect
        • Up to 36" x 24" PCBs via Automated Assembly
        • X-Ray Testing
        • RF Testing
        Accessories

        Accessories

        • Slot Adapters
        • Filter Panels
        • Air Impedance Module
        • IPMI Fan Controller
        Custom Sub-System Assembly

        Custom Sub-System  Assembly

        • Card-Cage thru Cabinet
        • Backplanes / Midplanes
        • Sheet metal / Machined Components
        • Peripheral PCBAs
        • Fan Trays
        • Harnessing / Cabling
        • Power Supplies
        • Functional Test
        • Design Services

        MicroTCA™

        Chassis Assembly

        Chassis Assemblies

        Single-Width
        • 4U, 5U, 6U Double-Width
        • 6U, 7U, 8U, 9U Triple/Quad-Width
        • 10U, 11U, 12U Ruggedized
        • ARINC 404 / 600 Flexible Options
        • Flush / Recessed
        • Fan-Tray / Cooling
        • Air Filtering
        • Finish / Graphics
        Backplanes

        Backplanes
        Dual-Star
        Single-Star
        Flexible Options

        • Up to 12AMCs
        • 1 or 2 PSU slots
        • 1 or 2 MCH slots
        • JTAG (JSM) Slot
        • Telco Alarm Slot
        • Zone 3 Interconnect
        • Slot Pitch
        • RoHS 5/6 or 6/6
        Accessories

        Accessories

        • Slot Adapters
        • Filter Panels
        • Air Impedance Module
        • IPMI Fan Controller
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